Principal Electrical Engineer - High-Speed Digital Design
Our client, a world-renowned leader in advanced semiconductor technology and high-performance computing, is seeking an exceptional Principal Electrical Engineer specializing in High-Speed Digital Design to join our elite, fully remote engineering team. This is a premier opportunity to work on groundbreaking projects that push the boundaries of digital signal integrity, power delivery, and complex board-level designs for next-generation processors and systems. As a Principal Engineer, you will provide technical leadership, mentor junior engineers, and drive innovation in a challenging and rewarding remote-first environment. Responsibilities: Lead the design, simulation, and verification of high-speed digital circuits and complex Printed Circuit Boards (PCBs) for cutting-edge semiconductor products. Develop robust signal integrity (SI) and power integrity (PI) analysis strategies and methodologies. Utilize advanced simulation tools (e.g., HyperLynx, Ansys) to model and optimize high-speed designs, minimizing reflections, crosstalk, and impedance mismatches. Collaborate closely with cross-functional teams, including IC designers, firmware engineers, mechanical engineers, and test engineers, to ensure seamless system integration. Define and implement design for testability (DFT) and design for manufacturability (DFM) strategies for complex PCBs. Oversee PCB layout design, ensuring adherence to high-speed design rules and signal integrity constraints. Develop and execute comprehensive verification and validation plans for digital designs. Troubleshoot and resolve complex electrical design issues encountered during development, validation, and production. Stay abreast of the latest advancements in high-speed digital design, interconnect technologies, and semiconductor packaging. Provide technical leadership and mentorship to junior electrical engineers, fostering a culture of technical excellence and innovation. Document design specifications, analysis results, and test reports. Participate in design reviews and provide constructive feedback to peers and cross-functional teams. Contribute to the development of architectural roadmaps for future high-performance computing platforms. Ensure efficient and effective communication and collaboration within the distributed engineering team. Drive innovation by exploring and implementing novel design techniques and technologies. Qualifications: Master's or Ph.D. in Electrical Engineering or a closely related field. Minimum of 10 years of progressive experience in electrical engineering, with a significant focus on high-speed digital design and PCB design. Demonstrated expertise in signal integrity (SI) and power integrity (PI) analysis for complex digital systems operating at multi-gigabit speeds. Proficiency with industry-standard SI/PI simulation tools (e.g., Ansys HFSS, Cadence Allegro PCB Designer, HyperLynx, ADS). Strong understanding of electromagnetic theory, transmission line theory, and high-speed networking protocols. Experience with processor architectures, memory interfaces (e.g., DDR), and high-speed serial interfaces (e.g., PCIe, SerDes). Proficiency in C/C++, Python, or other scripting languages for design automation and analysis. Experience with DFT/DFM techniques and working with PCB fabrication and assembly houses. Excellent analytical, problem-solving, and debugging skills. Exceptional leadership, communication, and interpersonal skills, crucial for remote collaboration. Ability to work independently, manage complex projects, and drive technical solutions to completion. Familiarity with FPGA design and verification is a plus. Experience with measurement equipment (oscilloscopes, VNAs, BERTs) for high-speed testing. A passion for cutting-edge technology and a drive for innovation. Join our world-class remote engineering team and help shape the future of high-performance computing. This role is based in San Francisco, California, US but is fully remote. Apply tot his job Apply To this Job